The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 13, 2001

Filed:

Jul. 21, 1999
Applicant:
Inventors:

Tomohiro Fukaya, Itami, JP;

Satoru Kukino, Itami, JP;

Junichi Shiraishi, Itami, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24D 3/00 ; C04B 3/500 ;
U.S. Cl.
CPC ...
B24D 3/00 ; C04B 3/500 ;
Abstract

A cBN sintered body superior in chipping resistance. The cBN sintered body is a sintered body in which cBN particles are bonded through a bonding phase. The bonding phase has a two-dimensionally continuous structure. The bonding phase comprises at least one kind selected from the group consisting of (a) carbide, nitride, carbonitride, or boride of a 4a-, 5a-, or 6a-group transition metal in the periodic table; (b) nitride, boride, or oxide of Al; (c) at least one kind of carbide, nitride, carbonitride, and boride of Fe, Co, or Ni; and (d) a mutual solid solution of those. The percentage of cBN content is 45 to 70% in volume. The bonding phase has the thickness of which the average value is 1.5 &mgr;m or less and the standard deviation is 0.9 &mgr;m or less with the cBN particles having an average particle size of 2 to 6 &mgr;m inclusive. The bonding phase has the thickness of which the average value is 1.0 &mgr;m or less and the standard deviation is 0.7 &mgr;m or less with the cBN particles having an average particle size of not less than 0.01 &mgr;m and less than 2.0 &mgr;m.


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