The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 13, 2001

Filed:

Oct. 19, 1999
Applicant:
Inventors:

George Steve Saloka, Dearborn, MI (US);

Mujeeb Ismael Ijaz, Ypsilanti, MI (US);

Prabhakar Singh, Export, PA (US);

Assignee:

Ford Global Technologies, Inc., Dearborn, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01D 5/322 ; B01D / ;
U.S. Cl.
CPC ...
B01D 5/322 ; B01D / ;
Abstract

A method of manufacturing thin foil alloys through a series of steps. A carrier having a polished carrier surface is placed within a deposition chamber. The carrier surface is generally polished to a mirrored surface finish. A sacrificial layer is applied atop the carrier surface. The sacrificial layer is made of a material that may be easily dissolved or separated from the carrier surface to remove the metal foil. The carrier surface and sacrificial layer are placed within the deposition chamber. The sacrificial layer is exposed to an evaporated first metal which becomes deposited upon the sacrificial layer. An evaporated second metal is then applied concurrently or sequentially with the first metal. The first and second evaporated metals solidify on the sacrificial layer to form a multilayer foil. At this point, the multilayer foil includes discrete layers or areas of the evaporated metals.


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