The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 13, 2001
Filed:
Oct. 13, 1999
Applicant:
Inventor:
Charles E. Williams, Dallas, TX (US);
Assignee:
Texas Instruments Incorporated, Dallas, TX (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 3/102 ; B23K 1/20 ;
U.S. Cl.
CPC ...
B23K 3/102 ; B23K 1/20 ;
Abstract
A method and apparatus for uniformly solder plating leads on semiconductor packages wherein the leads are rotated during the solder plating process and the solder on the leads in planarized and solder between and bridging the leads is removed by the application of a hot gas to the device having the leads. The hot gas is preferably N,which is inert to the process flow at the point in the process when it is utilized.