The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 06, 2001
Filed:
May. 17, 2000
Hidehiro Sasaki, Kawachi-gun, JP;
Masakazu Sakaguchi, Kanuma, JP;
Mitsuhiro Akiyama, Hiratsuka, JP;
Hisao Tokoro, Utsunomiya, JP;
JSP Corporation, Tokyo, JP;
Abstract
Propylene resin beads for molding expansion molded articles having improved high temperature resistance include as base resin metallocene-catalyzed copolymers of propylene with at least one or more of ethylene and ∝-olefins of 4 to 20 carbon atoms. The metallocene-catalyzed propylene copolymers are isotactic random copolymers characterized by a melting point higher than 140° C. to 160° C. and a melt flow rate (MFR) of not higher than 12 g/10 minutes, especially, 0.5 to 12 g/10 minutes. Expansion molded articles produced by expansion molding the expanded beads have a high temperature degree of deflection which is lower than that of metallocene-catalyzed propylene homopolymers and lower than that of Ziegler-Natta-catalyzed random propylene copolymers having the same comonomers and melting point.