The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 06, 2001
Filed:
May. 08, 2000
Applicant:
Inventors:
Assignee:
Infineon Technologies AG, Munich, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/166 ; G01R 3/126 ;
U.S. Cl.
CPC ...
H01L 2/166 ; G01R 3/126 ;
Abstract
A method for COB mounting of electronic chips on a circuit board includes contact connection of connecting wires and substantially whole-area adhesive bonding of a housing. A chip is partially adhesively bonded on a circuit board in such a way that the chip can be contact-connected and can be removed again without damage to the circuit board. Electronic tests or a burn-in process is performed on the chip. The chip, with a given functionality in a manner that is required for application of the circuit board, is fully adhesively bonding.
Münch, Thomas. (2001). Method for cob mounting of electronic chips on a circuit board (U.S. Patent No. 6312962). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6312962
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile