The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 06, 2001
Filed:
Dec. 14, 1999
Jin-Hyung Lee, Daejeonkwangyuk-shi, KR;
Byung Chul Moon, Seoul-si, KR;
Jin Lee, Kyongki-do, KR;
Jeong-Tak Moon, Kyongki-do, KR;
Chang-Rok Oh, Kyongki-do, KR;
Jae Gyu Nam, Kyongki-do, KR;
MK Electron Co., Ltd., Kyongki-do, KR;
Abstract
Method for manufacturing solder balls is disclosed. The apparatus comprises a tundish, a vibrator, a cooling liquid tank, an inactive atmospheric chamber, a molten metal receiving tray, a ball collecting barrel and a cooling liquid reservoir. The tundish has orifices at its bottom. The vibrator is immersed in the molten metal of the tundish and generates vibrations. The cooling liquid tank is situated under the tundish and is provided with a cooling liquid heater at its upper and middle outer surface and a cooling liquid cooler at its lower outer surface. The inactive atmospheric chamber is interposed between the bottom of the tundish and the top surface of the cooling liquid. The molten metal receiving tray is seated on a portion of the inactive atmospheric chamber and is horizontally movable. The ball collecting barrel is positioned under the cooling liquid tank and is provided with a cut-off valve at its top, a ball removing valve at its bottom and a cooling liquid supply conduit at its upper portion.