The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 06, 2001
Filed:
Apr. 07, 2000
Yoshitsugu Funada, Tokyo, JP;
Rieka Ohuchi, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
This invention provides a resin film preferably used for mounting a semiconductor chip on a substrate through flip-chip connection, and a method based on the use of such a resin film. The resin film has a laminated B/A/B structure where a first resin layer (A) having inorganic particles dispersed in an insulating resin is sandwiched by second and third resin layers (B) having no inorganic particles in their insulating resins. The method for connecting electronic parts comprises the steps of forming metal projections (bumps) on a plurality of connection terminals prepared on the surface of a first electronic part; preliminarily pressing the resin film against a plurality of connection terminal surfaces of the other electronic part; applying pressure onto the connection parts in the presence of heat after having properly aligned the metal projections of the first electronic part with the corresponding connection terminals of the other electronic part, thereby establishing electric connection and at the same time mechanical contact between the two electronic parts through the resin film melt and solidifying.