The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 06, 2001
Filed:
Dec. 06, 1999
Paul N. Marshall, Avon, CT (US);
Thomas C. Tseka, West Suffield, CT (US);
Brendan M. Walsh, Simsbury, CT (US);
James E. Fritz, Ellington, CT (US);
The Ensign-Bickford Company, Simsbury, CT (US);
Abstract
A shock-resistant electronic circuit assembly (,) is provided in which an electronic circuit is encased in an encapsulation (,) that engages a surrounding enclosure (,) in shock-dispersing contact therewith. The encapsulation may have a plurality of edges (,), fins (,) or bosses (,) that bear against the enclosure. The encapsulation may include a shock-absorbing material (,) disposed against the enclosure to protect the circuit against vibrations and a structural support material such as a casing (,) to protect the circuit against stress. The circuit assembly (,) may be part of a sheathed initiator assembly (,) that includes a transfer member (,) for converting shock wave energy into electrical energy for the electronic circuit, and the released energy may be converted into a detonation initiation signal. Assembly (,) may be part of a detonator (,) that receives a non-electric initiation signal and detonates following the delay determined by the electronic circuit. The detonator housing (,) or an optional sleeve (,) provides an enclosure for the assembly (,). The circuit encapsulation may include one or more bushings such as O-rings (,′) disposed about the circuit casing (,).