The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 30, 2001
Filed:
Apr. 24, 1998
Applicant:
Inventor:
Seong-young Han, Yongin, KR;
Assignee:
Samsung Aerospace Industries, Ltd., Changwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/3495 ; H01L 2/358 ; H01L 2/310 ; H01L 2/334 ; H01L 2/306 ;
U.S. Cl.
CPC ...
H01L 2/3495 ; H01L 2/358 ; H01L 2/310 ; H01L 2/334 ; H01L 2/306 ;
Abstract
A method of manufacturing a semiconductor package including the steps of adhering inner leads to a semiconductor chip surface via an insulating adhesive, forming an insulating layer on the semiconductor chip and upper surfaces of the inner leads such that bonding pads formed on the semiconductor chip and portions of the inner leads are exposed through an opening, forming a conductive layer in the opening to electrically connect the bonding pads to the inner leads, and forming a semiconductor package by molding the semiconductor chip, the inner leads, the insulating layer, and the conductive layer with a molding material.