The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 30, 2001

Filed:

Dec. 05, 2000
Applicant:
Inventors:

Itsuo Shibata, Hiratsuka, JP;

Shinichi Edagawa, Hiratsuka, JP;

Ryoichi Sekiguchi, Naka-gun, JP;

Hitoshi Toki, Isehara, JP;

Tamotsu Munakata, Fujisawa, JP;

Assignee:

JU-OH Inc., Hiratsuka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05B 6/36 ; B29C 4/573 ; B29C 3/308 ;
U.S. Cl.
CPC ...
H05B 6/36 ; B29C 4/573 ; B29C 3/308 ;
Abstract

In an induction heating method for a manifold in a hot runner mold, it is possible to uniformly heat a material over the entire length of a runner. Also, a coil is easily attached to and detached from the manifold. The hot runner mold includes a fixed mold and a movable mold, and a space is provided along a side surface of the manifold on which clamping force applied by the fixed mold and the movable mold does not act. A coil is wound to the side surface along an axial line of a runner of the manifold within the space such that the manifold is induction-heated from the side surface.


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