The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 30, 2001
Filed:
Jun. 24, 1999
Kaoru Okuno, Kanagawa, JP;
Ichiro Tsuchiya, Kanagawa, JP;
Kohei Kobayashi, Kanagawa, JP;
Tomoyuki Hattori, Kanagawa, JP;
Ken Takahashi, Kanagawa, JP;
Sumitomo Electric Industries, Ltd., Osaka, JP;
Abstract
A collectively coating die device (,) is provided for applying coating resin in a lump to coated optical fibers (,) arranged in parallel on one and the same plane so as to form a plurality of optical fiber ribbons (,) at the same time. The collectively coating die device (,) has a nipple portion (,) and a die portion (,), a resin accumulation space (,) formed between the nipple portion (,) and the die portion (,). The nipple portion (,) has two parallel planes and having a plurality of optical fiber passageways (,) shaped like ellipses in section and provided in the direction perpendicular to the planes. The die portion (,) has two parallel planes and has a plurality of optical fiber passageways (,) shaped like ellipses in section and is provided in the direction perpendicular to the planes. Each of the optical fiber passageways (,) of the nipple portion (,) has a tapered portion. Each of the optical fiber passageways (,) of the die portion (,) is constituted by a tapered portion and a straight portion in order from an inlet opening side. The optical fiber passageways (,) of the die portion (,) is disposed so as to correspond to the optical fiber passageways (,) of the nipple portion (,) respectively through the resin accumulation space (,).