The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 30, 2001
Filed:
Nov. 23, 1999
Hsi-Harng Yang, Hsinchu, TW;
Shih-Chou Chen, Hsinchu, TW;
Chuan-Kang Mu, Taichung, TW;
Jauh-Jung Yang, Taipei, TW;
Abstract
A manufacturing method for a high precision mold comprises the steps of (a) placing a plastic body on a conductor substrate, (b) forming a plurality of perforating apertures in the plastic body using X-ray deep etching molding, (c) rounding the edges at the front end of the perforating apertures using ultraviolet (UV) lithography, and (d) electroforming the high precision mold using the plastic body with perforating apertures as a model. A fiber connector sleeve can be further manufactured by (e) molding a fiber aligning element using the high precision mold, (f) molding a fiber sleeve body using an usual mold, and (g) combining the fiber aligning element with the fiber sleeve body using ultrasonic waves to form the fiber connector sleeve.