The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 30, 2001

Filed:

Nov. 23, 1999
Applicant:
Inventors:

Hsi-Harng Yang, Hsinchu, TW;

Shih-Chou Chen, Hsinchu, TW;

Chuan-Kang Mu, Taichung, TW;

Jauh-Jung Yang, Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/116 ;
U.S. Cl.
CPC ...
B32B 3/116 ;
Abstract

A manufacturing method for a high precision mold comprises the steps of (a) placing a plastic body on a conductor substrate, (b) forming a plurality of perforating apertures in the plastic body using X-ray deep etching molding, (c) rounding the edges at the front end of the perforating apertures using ultraviolet (UV) lithography, and (d) electroforming the high precision mold using the plastic body with perforating apertures as a model. A fiber connector sleeve can be further manufactured by (e) molding a fiber aligning element using the high precision mold, (f) molding a fiber sleeve body using an usual mold, and (g) combining the fiber aligning element with the fiber sleeve body using ultrasonic waves to form the fiber connector sleeve.


Find Patent Forward Citations

Quick Actions:

Yang, Hsi-Harng. (2001). Manufacturing method for high precision mold (U.S. Patent No. 6309488). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6309488

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…