The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 30, 2001
Filed:
Dec. 20, 1999
Daniel Alan Lawlyes, Kokomo, IN (US);
Jay Leonard Kelly, Kokomo, IN (US);
Anthony Raschilla, Girard, OH (US);
Delphi Technologies, Inc., Troy, MI (US);
Abstract
A high density wirebond connector assembly (,), including an enclosure (,), a circuit board (,), a high density connector (,), a connector housing (,), and a plurality of nail contacts (,). The circuit board (,) is comprised of a plurality of laminate layers (,) and rows of wirebond pads (,) positioned on the laminate layers (,). A plurality of wirebonds (,) run between individual nail contacts (,) and individual wirebond pads (,). By increasing the density of the high density connector (,), and decreasing the distance between the wirebond pads (,) and the nail contacts (,), a smaller, lighter, cheaper, and vibrationally resistant high density connector assembly (,) is provided.