The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 30, 2001
Filed:
Mar. 12, 1999
Minoru Hirai, Kyoto, JP;
Shigeyuki Ueda, Kyoto, JP;
Osamu Miyata, Kyoto, JP;
Tomoharu Horio, Kyoto, JP;
Rohm & Co., Ltd., Kyoto, JP;
Abstract
In the method of manufacturing an IC module (,) including a resin packaging process using upper and lower dies (,) for forming a cavity (,) while the dies are clamped, the resin packaging process is carried out by introducing a melted resin while a substrate (,) on which an IC chip (,) is placed and a coil (,A) which has a doughnut shape when observed from above and is flattened as a whole are housed in the cavity (,). When a substrate (,) on which an antenna coil (,) is patterned is to be packaged with a resin, the resin packaging process is carried out by forming a spacer (,) having an equal and almost equal height to the height of the cavity (,) on the substrate (,), housing it in the cavity (,), and introducing a melted resin. Instead of forming the spacer (,) on the substrate (,), a substrate (,) housed in a cavity (,) may be sucked. The manufacturing method can provide good protection of an IC chip and an antenna coil.