The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 23, 2001
Filed:
Mar. 16, 2000
David Richardson, Chandler, AZ (US);
Joseph Fernandez, Gilbert, AZ (US);
Dan Termer, Phoenix, AZ (US);
Microchip Technology Incorporated, Chandler, AZ (US);
Abstract
A method for attaching an integrated circuit die to a mounting structure, the method having the steps of: forming a mounting structure having a die pad and at least one spreader; applying an adhesive to the die pad and the at least one spreader of the mounting structure; and attaching the integrated circuit die to the adhesive, wherein the at least one spreader is between the die pad and the integrated circuit die. Also, an integrated circuit package having: a mounting structure having a die pad and at least one spreader; an adhesive adhered to the die pad and the at least one spreader of the mounting structure; and an integrated circuit die adhered to the adhesive, wherein the at least one spreader is between the die pad and the integrated circuit die. Finally, a mounting structure for an integrated circuit die, the mounting structure comprising: a die pad for supporting the integrated circuit die; and at least one spreader for supporting the integrated circuit die at a distance from the die pad.