The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 23, 2001

Filed:

Jun. 19, 2000
Applicant:
Inventor:

Bryan R. Gregory, Glen Ellyn, IL (US);

Assignee:

Corona Optical Systems, Inc., Lombard, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/36 ;
U.S. Cl.
CPC ...
G02B 6/36 ;
Abstract

A high-density blindmate optoelectronic module is provided. The high-density module is adapted to mount on a removable printed circuit board which is configured to be inserted into a printed circuit board support rack located within a chassis based network element. The high-density module is configured to blindmate with a multi-fiber optical connector mounted within the chassis based network element. The high-density blindmate optoelectronic module is formed of a transceiver mounting block which supports a plurality of connectorized optical sub-assemblies. Each connectorized optical sub-assembly includes a plurality of optical transmitters, optical receivers, or a combination of optical transmitters and optical receivers. The optical transmitters and/or receivers define optical axes that extend through a first side of connectorized optical sub-assemblies. The high-density blindmate optoelectronic module includes circuitry for driving the optical transmitters and processing optical signals received by the optical receivers. An electrical interface is provided for transferring signals between the transceiver module and the removable printed circuit board.


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