The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 16, 2001

Filed:

Sep. 07, 2000
Applicant:
Inventors:

Masakazu Fukada, Tokyo, JP;

Dai Nakajima, Tokyo, JP;

Ken Takanashi, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01K 7/20 ;
U.S. Cl.
CPC ...
H01K 7/20 ;
Abstract

Obtained is a power module which is excellent in electromagnetic shielding effects, is rarely influenced by external noises and acts as an external noise source with difficulty. An insulating substrate (,) is bonded through a solder (,) to a top surface of a heat sink (,) fixed to a support plate (,). A DC capacitor (,) is fixed to a bottom face of the heat sink (,) by adhesion. A control substrate (,) having a control IC (,) mounted thereon is fixed to the support plate (,). Moreover, a plurality of electrodes (,), a DC side electrode and refrigerant inlet-outlet (,) and a control connector (,) are provided on the support plate (,). A case (,) is fixed to a peripheral portion of the support plate (,), and surrounds the insulating substrate (,), the control substrate (,), the heat sink (,) and the DC capacitor,together with the support plate (,). Both the case (,) and the support plate (,) have conducting property.


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