The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 16, 2001
Filed:
Apr. 07, 1999
Seon Goo Lee, Seoul, KR;
Other;
Abstract
A thin, stackable semiconductor package having improved electrical and heat dissipating performance comprises a semiconductor chip having an integrated circuit and a plurality of input/output pads on a surface thereof. A lead frame having a plurality of inner leads with upper and a lower surfaces has one of those surfaces bonded to a surface of the chip with a bonding agent. The leads each has a projection formed on at least one of the upper and lower surfaces at a distal end portion of the lead. Each of the leads is electrically connected to an associated input/output pad of the chip through a wire bonding process using electrically conductive wires, or by a ball bonding process using electrically conductive balls. Alternatively, the leads may be directly bonded to the input/output pads of the chip by a TAB bonding process. An encapsulated portion envelops the semiconductor chip and the leads while exposing the projections of the leads to the atmosphere outside the encapsulated portion. A solder ball is welded to the bottom surface of the projection of each lead and is used as a signal input/output terminal of the package. A chip heat sink may be bonded to the chip to further increase the capacity of the package to dissipate heat away from the chip during operation.