The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 16, 2001
Filed:
Jul. 06, 1999
Cuong Van Pham, Belleville, MI (US);
Frank Burke DiPiazza, Highland, MI (US);
Jay DeAvis Baker, W. Bloomfield, MI (US);
Marc Alan Straub, Dearborn Heights, MI (US);
Vivek Amir Jairazbhoy, Farmington Hills, MI (US);
Visteon Global Technologies, Inc., Dearborn, MI (US);
Abstract
An interposer,for electrically coupling a semiconductor die,to a substrate,, comprising: an interposer body,made of a dielectric material and having a contact surface,and an opposed bonding surface,; a plurality of contact pads,arranged about the periphery of the contact surface,; a plurality of bonding pads,arranged across generally the entire area of the bonding surface,; and a plurality of electrically conductive conduits,disposed generally within the interposer body, such that each conduit,connects a respective one of the contact pads,with a respective one of the bonding pads,. The interposer,may also include: a sealed cooling channel,defined within the interposer body,; a fluid medium,generally filling the cooling channel,; and a piezoelectric element,attached to the interposer body such that the piezoelectric element communicates with the cooling channel,and the fluid medium,, the piezoelectric element being operatively coupled to at least two of the electrically conductive conduits