The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 16, 2001
Filed:
Sep. 18, 2000
Toshinobu Kawamura, Tokyo, JP;
Katsumi Satoh, Tokyo, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
A compression bonded type semiconductor device including a semiconductor substrate having a top surface and a bottom surface a gate electrode and a cathode electrode formed on the top surface of said substrate, and an anode electrode formed on the bottom surface of said substrate. Also included is an insulating cylinder accommodating the semiconductor substrate, a ring gate electrode contacting said gate electrode, and an external gate terminal having an outer periphery projecting from a lateral side of said insulating cylinder and being rigidly attached thereto, and having an inner periphery contacting said ring gate electrode. Further included is a control gate electrode configured to be electrically connected to said external gate terminal and an external control apparatus, a support member concentrically disposed with respect to the external gate terminal and having an elastic body configured to press together the external gate terminal and the control gate electrode, and a stack electrode configured to compress the compression bonded type semiconductor element and to support the support member.