The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 16, 2001
Filed:
Jan. 13, 1999
Applicant:
Inventors:
Gregory B. Hotchkiss, Richardson, TX (US);
Gonzalo Amador, Dallas, TX (US);
Assignee:
Texas Instruments Incorporated, Dallas, TX (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/144 ; H01L 2/148 ; H01L 2/150 ;
U.S. Cl.
CPC ...
H01L 2/144 ; H01L 2/148 ; H01L 2/150 ;
Abstract
A method for loading solder particles (,) onto an substrate comprising applying a flux (,) directly onto solder particles (,) either prior to or following adhering the solder particles (,) onto adhesive areas (,) of an adhesive coated film (,). The adhesive areas (,) of the adhesive coated film (,) are oriented to correspond with contact pads (,) of a substrate (,). The adhesive coated film (,) is aligned with the substrate (,) to transfer the solder particles (,) to the contact pads (,). The solder particles (,) may then be reflowed to securely attach the solder particles (,) to the contact pads(,).