The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 16, 2001
Filed:
Oct. 22, 1997
Hisashi Watanabe, Kisarazu, JP;
Takashi Tanaka, Kimitsu, JP;
Hiroyuki Chinju, Chiba, JP;
Seigo Oka, Kimitsu, JP;
Soichiro Kawamura, Kimitsu, JP;
Taeko Hayama, Kisarazu, JP;
Nippon Steel Chemical Co., Ltd., Tokyo, JP;
Abstract
This invention relates to laminates in which a layer of polyimide precursors and a layer of photosensitive resins are formed one on top of another on an electric conductor such as a stainless steel foil and also to laminates consisting of a stainless steel foil and successive layers of polyimide precursors and photosensitive resins useful for the manufacture of HDD suspensions. In particular, the use of resins containing a repeating unit derivable from specific aromatic diamines and aromatic carboxylic acid dianhydrides as polyimide precursors makes it possible to fabricate an insulator of high fabrication accuracy and reliability on an electric conductor and, in addition, the laminates are useful as materials for the manufacture of HDD suspensions of an integrated circuit/wiring structure with high accuracy.