The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 16, 2001
Filed:
Mar. 31, 2000
Hiroyuki Kimoto, Susono, JP;
Masatugu Nakanishi, Numazu, JP;
Akira Kato, Mishima, JP;
Yoshihiro Yamamura, Nagoya, JP;
Yukio Okochi, Toyota, JP;
Takatoshi Katsumata, Susono, JP;
Toyota Jidosha Kabushiki Kaisha, Toyota, JP;
Abstract
Embossed metallic flakelets have high damage resistance and can be produced readily. A method for production is also provided. The embossed metallic flakelets are produced by dip-coating an organic-inorganic composite layer,on upper and lower sides of a carrier layer made of a PVA film or the like by a sol-gel process, and pressing an original embossed pattern,having an embossed pattern against the organic-inorganic composite layer,under pressure to transfer the embossed pattern onto the organic-inorganic composite layer,. A sample having the transferred embossed pattern is sintered, to form a metallic film,on the organic-inorganic composite layer,by deposition or the like. The organic-inorganic composite layer,is dip-coated on the metallic film,by a sol-gel process, they are sintered, the carrier layer is dissolved in water to separate the metallic film,which is held between the organic-inorganic composite layers,on the upper and lower sides of the carrier layer, and the separated metallic film,is pulverized into embossed metallic flakelets.