The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 16, 2001
Filed:
Jun. 10, 1998
Suggy S. Chrai, Cranbury, NJ (US);
Ramaswamy Murari, Hillsborough, NJ (US);
Eugene Samuel Poliniak, Willingboro, NJ (US);
Hoi Cheong (Steve) Sun, Monmouth Junction, NJ (US);
Nitin Vithalbhai Desai, Princeton Junction, NJ (US);
Dominic Stephen Rosati, Hamilton, NJ (US);
Nalin Kumar, Cherry Hill, NJ (US);
William Ronald Roach, Rocky Hill, NJ (US);
Lawrence Harrison Hammer, Plainsboro, NJ (US);
Peter David Southgate, Monmouth Junction, NJ (US);
Bawa Singh, Voorhees, NJ (US);
Howard Christopher Rivenburg, Princeton, NJ (US);
David Keller, Newtown, PA (US);
Peter John Zanzucchi, Lawrenceville, NJ (US);
Aaron William Levine, Lawrenceville, NJ (US);
Prince Lal, Cherry Hill, NJ (US);
Other;
Abstract
A substrate is roboticaly picked up at a station and transported to a measuring station to measure the distance to a reference. The substrate is aligned to a robot before measurement. The measured substrate is then transported to a pharmaceutical or diagnostic powder/grain deposition station where the powder/grains are controllably deposited on the substrate to predetermined thicknesses over a plurality of powder/grain collection zones. The deposited powder/grains are then measured to determine the thickness and area covered by the deposited powder/grains at each collection zone. The substrate is then transported to a lamination station and each collection zone of powder/grains is welded to a cover substrate. The system remembers which collection zones are out of specification so that they can be later selectively discarded.