The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 16, 2001

Filed:

Dec. 29, 1999
Applicant:
Inventors:

Kouji Aokie, Anjo, JP;

Naotaka Murakami, Anjo, JP;

Hiroki Takata, Anjo, JP;

Osamu Yamato, Anjo, JP;

Katsuhiko Onoda, Shizuoka, JP;

Assignee:

Other;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 1/200 ;
U.S. Cl.
CPC ...
H01R 1/200 ;
Abstract

In order to precisely detect positions of respective lead portions of an electronic component and to reduce the cost of production of the electronic component, the electronic component has a resinous pad portion and a plurality of terminal units embedded in the pad portion. Each of the terminal units is provided with lead portions that are disposed parallel to one another with their terminal faces exposed, and junction portions for junction between bonding wires and the lead portions are formed on the terminal faces. Corner portions are formed at predetermined sections on the terminal faces. In this case, even if resin of the pad portion has adhered to the peripheries of the terminal faces and fouled the terminal faces, since the lead portions have the corner portions, images of the lead portions can be detected precisely. Accordingly, the operation of connecting the bonding wires to the terminal faces is performed more efficiently, whereby the cost of production of the electronic component can be reduced.


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