The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 16, 2001
Filed:
Nov. 20, 1998
Applicant:
Inventor:
Robert Sykes, Tendring, GB;
Assignee:
Dage Precision Industries, Inc., Buckinghamshire, GB;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01N 3/08 ;
U.S. Cl.
CPC ...
G01N 3/08 ;
Abstract
Apparatus for testing electrical wire bonds of semiconductor devices includes two unequal length cantilever arms (,) on a baseplate (,) and a test head (,) at the free end of the arms. The arrangement ensures substantially frictionless straight line movement of a test hook (,) on the text head over the range of deflection expected. A pneumatic or magnetic (,) frictionaless damper is disclosed. The test hook (,) may be orientated by a stepper motor (,) of the test head.
Sykes, Robert. (2001). Apparatus for testing the integrity of a bond (U.S. Patent No. 6301971). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6301971
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile