The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 09, 2001
Filed:
May. 20, 2000
Mitsuaki Ootani, Tokyo, JP;
Taiyo Yuden Co.,Ltd., Tokyo, JP;
Abstract
The present invention provides a multilayered electronic component (,) having improved thermolytic effect for an electronic circuit module (,), facilitating the realization of a miniaturization of the electronic circuit module (,). The multilayered electronic component (,) is provided with a first surface (,), a second opposite surface and side surfaces. A heat dissipation pattern (,) is formed in the multilayered electronic component (,) in a vicinity of the first surface (,) thereof on which a plurality of lands (,) is formed, in such a way that at least one land (,) is electrically connected to the heat dissipation pattern (,). A semiconductor chip (,) is mounted on the first surface (,) of the multilayered electronic component (,), thereby forming the electronic circuit module (,). Heat induced in the semiconductor chip (,) is emitted from the heat dissipation pattern (,), which will, in turn, make a thermolytic effect of the electronic circuit module (,) be improved.