The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 09, 2001
Filed:
Aug. 31, 1999
Raoul B. Salem, Redwood City, CA (US);
Sun Microsystems, Inc., Palo Alto, CA (US);
Abstract
An electronic assembly is described herein having a first semiconductor integrated circuit substrate with circuitry disposed thereon. This semiconductor integrated circuit substrate is coupled with a package through a first plurality of electrical connections. Sandwiched between portions of the semiconductor integrated circuit substrate and the package is an electronic assembly which is coupled to the semiconductor substrate circuitry and also the package through low resistance, low inductance connections. An electronic subassembly is described which includes a second semiconductor substrate having circuitry disposed thereon, the circuitry forming one or more of a capacitor, a charge pump, or a voltage regulator. Insulating material is disposed over the circuitry, and vias are formed therethrough. Metal bands are disposed to be continuous around the outside of the subassembly, thereby also forming a connection with the second semiconductor circuitry. The electronic subassembly metal bands then make connections with the circuitry of the semiconductor integrated circuit substrate and the package.