The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 09, 2001

Filed:

Mar. 12, 1998
Applicant:
Inventors:

Hideki Ina, Utsunomiya, JP;

Setsuo Minami, Kawasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/1027 ;
U.S. Cl.
CPC ...
H01L 2/1027 ;
Abstract

A circuit pattern surface curving in correspondence with the surface shape of a ball-like semiconductor device material such as a silicon ball is formed in a reticle. A resist-applied surface of the device material is so exposed as to move the ball-like semiconductor device material close to the circuit pattern surface. In this manner, a circuit pattern is formed on the surface of the ball-like device material.


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