The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 09, 2001
Filed:
May. 04, 2000
Applicant:
Inventors:
Takanori Kido, Shiojiri, JP;
Fumio Tsujino, Shiojiri, JP;
Kagetaka Ichikawa, Shiojiri, JP;
Nobuo Uotani, Chiba, JP;
Assignee:
Showa Denko K.K., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
C09K 3/14 ; C09G 1/04 ; B24B 1/00 ;
U.S. Cl.
CPC ...
C09K 3/14 ; C09G 1/04 ; B24B 1/00 ;
Abstract
A polishing-material composition, for polishing of LSI devices, which is a polishing-material composition comprising water and cerium oxide which has been surface-treated with a coupling agent, wherein the maximum value is no greater than about 5 &mgr;m and the average value is about 0.01-1.0 &mgr;m in the secondary particle size distribution of the cerium oxide. Also, a polishing method for LSI devices which employs the polishing-material composition.