The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 09, 2001
Filed:
Jul. 14, 2000
Frank Edward Anderson, Sadieville, KY (US);
Stanley Dyer, Georgetown, KY (US);
Christopher Dane Jones, Georgetown, KY (US);
Shirish Padmaker Mulay, Lexington, KY (US);
William Shannon Spencer, Lexington, KY (US);
Lexmark International, Inc., Lexington, KY (US);
Abstract
A method of controlling a temperature of a print chip of a printhead in an ink jet printer includes providing the printer with a memory device. The print chip is provided with and at least one ink-jetting resistor. The printhead is provided with at least one substrate heater and a heatsink attached to the print chip. Power is applied to the substrate heater and/or the ink-jetting resistor. Temperature data associated with the print chip is recorded during the applying step. A thermal resistance value of the print chip to the heatsink and/or a thermal capacitance value associated with the printhead is calculated dependent upon the recorded temperature data. The thermal resistance value of the print chip to the heatsink and/or the thermal capacitance value associated with the printhead are stored in the memory device. A temperature of the heatsink is measured based upon the thermal resistance value of the print chip to the heatsink, the thermal capacitance value associated with the printhead, a temperature of the print chip, an ambient temperature, and/or a thermal resistance value associated with the heatsink. A level of power to be applied to the substrate heater is set dependent upon the thermal resistance value of the print chip to the heatsink and/or the thermal capacitance value associated with the printhead, and the temperature of the heatsink.