The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 09, 2001

Filed:

Oct. 19, 1999
Applicant:
Inventor:

Setsuyuki Takeuchi, Nagano-ken, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B65D 1/02 ; B65D 1/10 ; B65D 2/300 ;
U.S. Cl.
CPC ...
B65D 1/02 ; B65D 1/10 ; B65D 2/300 ;
Abstract

A heat-resistant packaging container made of a polyester resin, formed by stretch-blow molding is provided. A top portion of a bottom face is formed to have a large wall thickness to impart a resistance to heat deformation. A peripheral wall of the bottom face is formed to have a wall thickness that is gradually reduced from the top portion toward an arc grounding edge around the bottom face. An outer peripheral wall of the bottom portion is stretch molded from inside of the grounding edge so as to have a wall thickness as same as that of the body portion to attain a heat resistance. The inside of the grounding edge connecting to the peripheral wall of the bottom face is formed into a tilt surface which is oriented upwardly in consideration of an amount of expanding deformation &agr; of the grounding edge due to heating and loading. By forming the bottom face in consideration of a deformation amount of the grounding edge of the bottom face of the container due to heating and loading of contents, it is possible to keep the levelness of the grounding edge even after the heating.


Find Patent Forward Citations

Loading…