The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 02, 2001
Filed:
Sep. 22, 1999
Thomas Dixon Dudderar, Chatham, NJ (US);
Dean Paul Kossives, Glen Gardner, NJ (US);
Yee Leng Low, Berkeley Heights, NJ (US);
Agere Systems Guardian Corp., Orlando, FL (US);
Abstract
The specification describes a recessed chip MCM package with integrated electromagnetic shielding. The surfaces of the cavity which houses the IC devices are coated with metallization. The normally exposed top and side surfaces of the MCM package are also metallized. A solder wall is provided on the interconnect PCB which seals the gap between the MCM tile and the PCB interconnect substrate. The solder wall can be formed using standard solder bump technology, and the seal between the MCM and the PCB may be made during the same reflow operation that is used to flip-chip bond the MCM tile to the PCB.