The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 02, 2001
Filed:
Aug. 15, 2000
Julian Y. Chang, Taipei, TW;
Da-Zen Chuang, Taipei, TW;
Nan Ya Technology Corporation, Taoyuan, TW;
Abstract
The invention relates to a semiconductor process, and in particular to a method and structure of manufacturing contact windows between different levels of two conductive layers (a upper conductive layer and a lower conductive layer) in the semiconductor process. In the method, first, a trench is formed under a subsequently-formed contact window between the upper conductive layer and lower conductive layer. The trench may be located on the insulating layer under the lower conductive layer. When the lower conductive layer is subsequently formed, the trench can be filled with the lower conductive layer. Therefore, part of the lower conductive layer on the trench is thicker than that on the other regions. When the insulating layer between the upper conductive layer and lower conductive layer is formed, an etching process is then performed to form the contact window, the contact window can not cross the lower conductive layer due to the lower conductive layer on the trench being sufficiently thick. Accordingly, the contact area between the upper conductive layer and lower conductive layer is increased, thereby reducing the contact resistance thereof.