The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 02, 2001
Filed:
Jun. 04, 1999
Applicant:
Inventor:
Sumio Koiwa, Chiba, JP;
Assignee:
Seiko Instruments Inc., , JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/1331 ;
U.S. Cl.
CPC ...
H01L 2/1331 ;
Abstract
To provide a method of manufacturing a semiconductor device in which an epitaxial growth film is formed on a semiconductor substrate having a buried layer, which is capable of reducing the manufacturing time of the semiconductor device or reducing the IC chip area. The method of manufacturing a semiconductor device is characterized by including a process of selecting the concentration of the p-type conductive impurities which put the surface of the silicon semiconductor substrate into a full amorphous state and conducting doping with the impurities.