The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 25, 2001
Filed:
Feb. 07, 2000
Applicant:
Inventors:
Kazuaki Sumita, Gunma-ken, JP;
Kimitaka Kumagae, Gunma-ken, JP;
Miyuki Wakao, Gunma-ken, JP;
Toshio Shiobara, Gunma-ken, JP;
Assignee:
Shin-Etsu Chemical Co., Ltd., Toyko, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/912 ;
U.S. Cl.
CPC ...
H01L 2/912 ;
Abstract
In a liquid epoxy resin composition comprising a liquid epoxy resin and an inorganic filler, a specific imidazole compound having a solubility of up to 1% by weight in the epoxy resin, a melting point of at least 170° C., a mean particle diameter of 1-5 &mgr;m, and a maximum particle diameter of up to 20 &mgr;m is used as a curing accelerator. The resulting composition is suited as a sealing material for flip-chip type semiconductor devices since it has improved thin-film infiltration and storage stability.