The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 25, 2001
Filed:
Jun. 12, 2000
Applicant:
Inventors:
Walter Schmidt, Zürich, CH;
Marco Martinelli, Neftenbach, CH;
Assignee:
Dyconex Pantente AG, Zug, CH;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01K 3/22 ;
U.S. Cl.
CPC ...
H01K 3/22 ;
Abstract
A method for producing a foil circuit board including a plurality of flexible electrically non-conductive and flexible conductive layers, which are laminated together. The non-conductive layers are positioned between the conductive layers and two of the conductive layers are the outermost surface layers of the foil circuit board. The circuit board includes flexible areas and rigid areas, and the flexible areas are provided by etching the board to remove at least part of one of the outermost surface layers and an adjacent underlying non-conductive layer.