Solderable optical mount

Abstract

A method and apparatus for mounting components to an optical bench is provided. The mount allows the components to be easily detached, realigned, and remounted at will. Components that can use the mount include, but are not limited to, mirrors, output couplers, windows, filters, lenses, optical fibers, nonlinear crystals, active and passive Q-switches, piezoelectric elements, apertures, laser gain media, and detectors. The optical component is mounted to an upright portion of the optical mount, the upright portion being mounted to a base plate. The base plate includes a heater, such as a resistive heater, that is used to solder the base plate to the optical bench. Preferably the heater is electrically coupled to a pair of contacts located on the upright portion of the mount, thus providing an easy method of coupling a power source to the heater. To reposition the mount once it has been soldered to the optical bench, the heater is activated thereby melting the solder, the mount is repositioned, and the heater is deactivated. Deactivation of the heater causes the solder to resolidify, thus recoupling the mount to the bench. In another aspect, a mounting tool is provided. The mounting tool grasps the mount with a pair of arms, the arms holding the mount without blocking access to the optical component. Preferably the two arms of the mounting tool are electrically isolated from one another and are designed to contact the pair of electrical connectors on the upright. In use the tool grasps the mount, applies sufficient voltage to the heater to melt the base plate mounting solder, positions the mount in the desired location, and deactivates the power source. After the solder has solidified, coupling the base to the mounting surface, the mounting tool can be released.