The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 18, 2001
Filed:
Feb. 10, 1999
Applicant:
Inventors:
Toshio Ogawa, Hitachinaka, JP;
Masaaki Takahashi, Hitachi, JP;
Masahiro Gouda, Hitachi, JP;
Noritaka Kamimura, Hitachinaka, JP;
Kazuhiro Suzuki, Mito, JP;
Junichi Saeki, Yokohama, JP;
Kazuji Yamada, Hitachi, JP;
Makoto Ishii, Utsunomiya, JP;
Akihiro Tamba, Hitachi, JP;
Assignee:
Hitachi, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/334 ;
U.S. Cl.
CPC ...
H01L 2/334 ;
Abstract
A semiconductor device includes a main circuit part having a semiconductor device formed on an electrode plate of a lead frame and a control circuit part having protective functions, which is integrally molded by a resin mold part into an integral mold structure.