The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 18, 2001
Filed:
Jul. 21, 1999
Applicant:
Inventors:
Assignee:
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/144 ; H01L 2/148 ; H01L 2/150 ;
U.S. Cl.
CPC ...
H01L 2/144 ; H01L 2/148 ; H01L 2/150 ;
Abstract
A method for manufacturing a semiconductor chip (,) which is bonded on a die pad (,) of a leadframe, and inner leads (,) are electrically connected to electrode pads of the semiconductor chip (,) with metal fine wires (,). The die pad (,), semiconductor chip (,) and inner leads are molded with a resin encapsulant (,). However, no resin encapsulant (,) exists on the respective back surfaces of the inner leads (,), which protrude downward from the back surface of the resin encapsulant (,) so as to be external electrodes (,).