The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 18, 2001

Filed:

Nov. 30, 1997
Applicant:
Inventor:

J. Michael Caldwell, Cardiff, CA (US);

Assignee:

Nextec Applications, Inc., Vista, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B05C 1/104 ; B05C 3/132 ; B05D 1/42 ;
U.S. Cl.
CPC ...
B05C 1/104 ; B05C 3/132 ; B05D 1/42 ;
Abstract

The present invention relates to an apparatus for controlling the placement of a curable, shear-thinnable polymer composition into a porous web. The apparatus comprises means for applying tension, means for applying the polymer composition to one surface of the tensioned web, and means for shear thinning the composition and placing it into the web to encapsulate at least some of the structural elements of the web, leaving most of the interstitial spaces open. A preferred apparatus includes one or more process heads that has mounted thereto a rigid knife blade for engagement with the web. The knife blade is movable vertically and rotationally. The process head is also movable horizontally along the path of the web. The invention also relates to an apparatus for selectively placing the polymer composition in a substantially continuous region extending through the web so that the polymer composition fills the interstitial spaces and adheres adjacent structural elements of the web in the region. In the areas of the web above and below the filled region, at least some of the structural elements are encapsulated and most of the interstitial spaces are open.


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