The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 18, 2001

Filed:

Nov. 17, 1999
Applicant:
Inventors:

Phillip William Eckels, Florence, SC (US);

Richard Thomas Hackett, Sumter, SC (US);

Gregory F. Hayworth, Florence, SC (US);

Xianrui Huang, Florence, SC (US);

Clifford J. Ginfrida, Florence, SC (US);

Gregory Alan Lehmann, Florence, SC (US);

John Scaturro, Jr., Florence, SC (US);

Bu-Xin Xu, Florence, SC (US);

Assignee:

General Electric Company, Schenectady, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F17C 5/02 ;
U.S. Cl.
CPC ...
F17C 5/02 ;
Abstract

A multi purpose interconnect assembly between upper and lower helium vessels in a recondensing superconducting magnet to provide isothermal connections to extend the ride-through period, and to provide for helium liquid and gas passage, electrical interconnections, and to accommodate differential thermal contraction and expansion.


Find Patent Forward Citations

Eckels, Phillip. (2001). Superconducting magnet split cryostat interconnect assembly (U.S. Patent No. 6289681). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6289681

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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