The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 11, 2001
Filed:
Dec. 02, 1999
Tadashi Narita, Tokyo, JP;
Makiko Nakamura, Tokyo, JP;
Oki Electric Industry Co., Ltd., Tokyo, JP;
Abstract
There is disclosed a wiring structure for a semiconductor device being excellent in the resistance against electromigration and being able to lengthen a life of the wiring. The wiring structure is comprised of a refractory metal layer and an aluminum alloy layer being stacked on the refractory metal layer. The wiring structure contains a compound layer produced between the refractory metal layer and the aluminum alloy layer. The refractory metal layer is parted in the extended direction of the wiring to prevent the compound layer produced between the refractory metal layer and the aluminum alloy layer from being ranged in the extended direction of the wiring. A length of an interval between the parted refractory metal layer portions is set to exceed a value being twice as large as a thickness of the compound layer. This prevents the compound layer growing between faces of refractory metal layer portion being opposite to each other being ranged each other.