The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 11, 2001

Filed:

Dec. 28, 1999
Applicant:
Inventors:

Ping Mei, Palo Alto, CA (US);

Jeng Ping Lu, Mountain View, CA (US);

Francesco Lemmi, Menlo Park, CA (US);

Robert A. Street, Palo Alto, CA (US);

James B. Boyce, Los Altos, CA (US);

Assignee:

Xerox Corporation, Stamford, CT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 3/1075 ; H01L 3/1105 ; H01L 3/1117 ;
U.S. Cl.
CPC ...
H01L 3/1075 ; H01L 3/1105 ; H01L 3/1117 ;
Abstract

A method and apparatus for reducing vertical leakage current in a high fill factor sensor array is described. Reduction of vertical leakage current is achieved by eliminating Schottky junction interfaces that occur between metal back contacts and intrinsic amorphous silicon layers. One method of eliminating the Schottky junction uses an extra wide region of N doped amorphous silicon to serve as a buffer between the metal back contact and the intrinsic amorphous silicon layer. Another method of eliminating the Schottky junction completely replaces the metal back contact and the N doped amorphous silicon layer with a substitute material such as N doped poly-silicon.


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