The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 11, 2001
Filed:
Nov. 30, 1998
Other;
Abstract
A wiring board for flip-chip-mounting in which a conductor layer is provided in a portion under the semiconductor element-mounting surface of the ceramic insulating board, the electrically conducting layer being electrically independent from the wiring pattern that is flip-chip-connected. The insulating board is effectively suppressed from deforming such as from warping or undulating. In particular, the semiconductor element-mounting surface exhibits a high degree of flatness. Therefore, the wiring board exhibits a high junction reliability at the flip-chip-connected portions, and is very useful as a semiconductor package or as a hybrid integrated circuit that is used in various electronic devices being mounted on the vehicles.