The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 11, 2001
Filed:
Dec. 14, 1999
Isao Ueoka, Osaka, JP;
Masaaki Yamauchi, Osaka, JP;
Masaharu Kurata, Aichi, JP;
Yoshihiro Nakazawa, Aichi, JP;
Yuki Matsuura, Aichi, JP;
Hideyuki Hashimoto, Aichi, JP;
Hiromitu Asai, Aichi-pref, JP;
Shinichi Matsubara, Aichi-pref, JP;
Makoto Takahashi, Aichi-pref, JP;
Other;
Abstract
An insulated wire having excellent fabricability causing no cracking in the film even after severe winding or rolling fabrication and also having heat resistance comparable to that of polyamideimide is disclosed, in which a first insulation layer of a thermosetting resin composition having a Tg of 250° C. or higher is formed on a conductor, on which a second insulation layer formed of a mixture of a thermosetting resin composition having a Tg of 250° C. or higher and a thermoplastic resin composition having a Tg of 140° C. or higher is formed, and in which the adhesion of the insulation film to the conductor is 30 g/mm or more, and the elongation at break of the insulation film is 40% or more, with the mixing ratio of the thermoplastic resin in the second insulation layer being from 30 to 70% by weight and the ratio T,/T,of the thickness T,of the first insulation layer to the thickness T,of the second insulation layer being within a range of 5/95 to 40/60, and a residual amount of the solvent in an insulation film is 0.05% by weight or less of the total amount of the insulation film in a preferred embodiment.