The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 11, 2001
Filed:
Apr. 22, 1999
Applicant:
Inventors:
Assignee:
Nitto Denko Corporation, Osaka, JP;
Primary Examiner:
Int. Cl.
CPC ...
C08L 6/300 ; C08L 6/304 ;
U.S. Cl.
CPC ...
C08L 6/300 ; C08L 6/304 ;
Abstract
An epoxy resin composition for semiconductor encapsulation comprising (A) an epoxy resin, (B) a phenolic resin, and (C) butadiene rubber particles having an average particle size of secondary particles of 100 &mgr;m or smaller and having such a size distribution that the proportion of secondary particles having a particle size of 250 &mgr;m or smaller is 97% by weight or more, and the proportion of secondary particles having a particle size of 150 &mgr;m or smaller is 80% by weight or more. Component (C) is uniformly dispersed in the composition without forming coarse agglomerates to secure low stress properties.