Feeder for electronic chip components

Abstract

An electronic chip component feeder is provided to prevent continued supply of electronic chip components for mounting which have surface discolorization, deteriorated electrode solderability, or cracks or chips produced by chip collisions. The electronic chip component feeder includes plural feeding units arranged in an array. Each feeding unit has a hopper for holding a plurality of components of a particular kind, and a guide path by which components are transferred from the hopper to a dispensing location. At the dispensing location, the components are picked up by a sucking chuck and then transferred to a substrate for mounting thereon. The plurality of feeding units are capable of being reciprocated in unison so that the dispensing location for the feeding units are successively moved to a fixed position. The electronic chip component feeder further includes a counting unit for counting the number of movements of the each feeding unit. This provides a measure of the degree of potential degradation of the electronic chip components in the hoppers caused by movement of their respective feeding unit. An alarm can be generated when the counted number reaches a predefined number, set individually for each feeding unit.