The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 11, 2001
Filed:
Jul. 21, 2000
Ray G. Brooks, Bedford, TX (US);
Timothy Brooks, Euless, TX (US);
Steve L. Fowler, Moore, SC (US);
Robert A. Neal, Wales, ME (US);
Other;
Abstract
A container for integrated circuit wafers provides protection for the wafers from mechanical shock and electrical charges. The wafers are mechanically protected by top and bottom cushions and side cushions. The top and bottom cushions each have foam within a membrane or film enclosure. The enclosure has openings so as to allow gas to pass in and out. The side cushions have resilient projections that protect the edges of the wafers. The side cushions are interposed between flanges of the top and bottom cushions. The individual wafers are separated from each other by leaf separators made of film. The film for the separators and the top and bottom cushions can be the same type. The film has a first layer made of a polymer with dissipative material therein and a second layer made of a polymer without the dissipative material. The first and second layers are coupled together. The insulating layer is placed into contact with a circuit side of the wafer. The dissipative material can be carbon. The container has a grounding stud in a wall. The grounding stud contacts the film on the inside of the container and can contact a ground on the exterior of the container.