The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 04, 2001
Filed:
Aug. 26, 1998
Masaru Ando, Kamakura, JP;
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Abstract
The semiconductor device has two sets of semiconductor units,having a plurality of semiconductor pellets,arranged and connected in parallel on the same plane, which are connected in series with a common electrode plate,intervened between the semiconductor units,An anode plate,and a cathode plate,are arranged in parallel on both sides of the semiconductor units,These electrode plates are pushed against the opposed main faces of the semiconductor pellets,by pushing force of coned disc springs,A press-connecting screw member consisting of a through bolt,and a nut,is set through the center of the semiconductor units and the like. A pushing force is uniformly applied to respective parts of the electrode plates without being dispersed, and the electrode plates are securely pushed against the respective semiconductor pellets,Thus, the semiconductor pellets,and the electrode plates and the like are securely connected by press connecting, thereby preventing a fatigue failure or breakage due to a difference in thermal expansion coefficient from being caused even if heating and cooling are repeated while the semiconductor device is operating.